Miniaturization and power efficiency have long defined sensor designs. Enter artificial intelligence (AI) and software ...

Edge computing has been a hot topic at CES 2025, but what is the underlying hardware and how do the implementations vary?

Mitsubishi announced that it has begun shipping samples of two S1-Series high-voltage IGBT modules rated at 1.7 kV.

HaiLa Technologies has introduced the EVAL2000 development board, featuring its BSC2000 passive backscatter Wi-Fi chip and ST ...

Synaptics is pairing Google’s ML core with its Astra AI-native hardware and open-source software to simplify IoT device ...

Processing-in-memory (PiM), a silver bullet for TinyML, is just one tool to execute SLMs and some LLMs effectively at the far ...

TI’s automotive SoC releases for CES 2025 this year: a radar sensor for passenger safety, new audio processor solutions, and ...

Heat shrink tubing, rarely referred to simply as “HST” even in our acronym-intensive world, is made of cross-linked polymers ...

Canyon Bridge has hired Lazard Inc. to seek a buyer for British graphics chip designer Imagination Technologies.

Flat-membrane speaker drivers could be acoustically superior to cone-shaped ones, but relying on theoretical benefits isn’t always a safe bet.

According to a report published in Economic Daily News, TSMC has successfully integrated CPO with advanced semiconductor ...

A year ago in his 2023 retrospective intro, our engineer referenced one of his favorite sayings, “the only constant is change ...