Alphawave Semi proudly announced its recognition as the recipient of the TSMC 2024 OIP Partner of the Year Award for ...

Memory has been selected as the 2024 TSMC Open Innovation Platform® (OIP) Partner of the Year for Specialty Embedded Memory ...

The connected world we live in today depends on billions of chips. The sheer volume of chips required for a functioning ...

SIAE MICROELETTRONICA has selected EnSilica to assist the design of Application-Specific Integrated Circuits (ASICs) for its ...

EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BAE ...

EnSilica is pleased to announce that it has joined the Design Center Alliance ("DCA") of the Taiwan Semiconductor ...

Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have ...

Dolphin Design, the leader in Power management IP, and SigmaSense, the leader in direct-to-digital precision sensing, today ...

Incorporating BroadR-Reach™ technology for Automotive Excellence, this PHY delivers exceptional performance for automotive and industrial applications, providing a superior alternative to traditional ...

Comcores and EXTOLL have successfully performed the interoperability test of Comcores JESD204C IP with Extoll PHY.

Certus is excited to announce that its 1.2V/3.3V wire-bond I/O library in TowerJazz’s 65nm process is silicon-verified, and ...