Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Taiwan Semiconductor Manufacturing has outperformed 2024 expectations by wide margins. Check out 3 reasons to buy TSM stock.

A chiplet supermarket is still years off, but progress is being made on all fronts.

TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Krish Sankar, an analyst from TD Cowen, maintained the Hold rating on TSMC (TSM – Research Report). The associated price target was raised to ...

TSMC's Arizona Fab 21 began 4nm chip mass production in Q4 2024. Costs are higher than in Taiwan; 2nm production starts in ...

TSMC reported record profits for the fourth quarter of 2024, fueled by booming demand for artificial intelligence (AI) chips.